creat by art - glass passivated junction chip - ideal for automated placement - low profile package - low power loss, high efficiency - halogen-free according to iec 61249-2-21 molding compound, ul flammability classification rating 94v-0 moisture sensitivity level: level 1, per j-std-020 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated l eads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test symbol ES1DFL es1gfl es1jfl unit edf egf ejf v rrm 200 400 600 v v rms 140 280 420 v v dc 200 400 600 v i f(av) a c j pf t rr ns t j c t stg c document number: ds_d0000120 version: a15 8 sod-123fl 1 30 1.00 1.30 1.70 ES1DFL - es1jfl 1a, 200v - 600v surface mount su p er fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanicalw data case: sod-123fl polarity: indicated by cathode band weight: 0.016 g (approximately) maximum ratings and electrical characteristics (t a =25c unless otherwise noted) maximum repetitive peak reverse voltage parameter i r a maximum rms voltage maximum dc blocking voltage maximum average forward rectified current marking code maximum reverse recovery time (note 3) typical thermal resistance r jl r ja maximum reverse current @ rated v r t j =25c t j =125c a maximum instantaneous forward voltage (note 1) @ 1 a v f v c/w 100 35 i fsm typical junction capacitance (note 2) peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load note 3: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a taiwan semiconductor 35 85 operating junction temperature range storage temperature range note 1: pulse test with pw=300 s, 1% duty cycle - 55 to +150 - 55 to +150 5 note 2: measured at 1 mhz and applied vr=4.0 volts.
document number: ds_d0000120 version: a15 sod-123fl 3,000 / 7" plastic reel sod-123fl 10,000 / 13" paper reel ratings and characteristics curves (t a =25c unless otherwise noted) ES1DFL - es1jfl taiwan semiconductor ordering information packing code suffix package green compound es1jfl rvg g rv es1jfl note 2: whole series with green compound ( halogen-free) example preferred p/n packing code suffix description part no. es1xfl (note 1) packing code rv rq part no. packing code note 1: "x" defines voltage from 200v (ES1DFL) to 600v (es1jfl) packing g 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 average forward current (a) lead temperature ( c) fig.1 forward current derating curve resistive or inductive load 0 5 10 15 20 25 30 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.01 0.1 1 10 100 0 20406080100 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics t j =125 c t j =25 c 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 instantaneous forward current (a) forward voltage (v) fig. 2 typical forward characteristics pulse width=300 s 1% duty cycle es1jfl
min max min max a 0.80 1.10 0.031 0.043 b 1.70 2.00 0.067 0.079 c 2.60 3.10 0.102 0.122 d 0.90 1.10 0.035 0.043 e 0.10 0.25 0.004 0.010 f 0.43 0.90 0.017 0.035 g 3.50 3.90 0.138 0.154 p/n = marking code g = green compound code yw = date code f = factory code document number: ds_d0000120 version: a15 marking diagram sod-123fl dim. unit (mm) unit (inch) ES1DFL - es1jfl taiwan semiconductor package outline dimensions 0 2 4 6 8 10 12 14 16 18 20 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d0000120 version: a15 ES1DFL - es1jfl taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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